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| datashee t . 1/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 tsz22111 ? 14 ? 001 www.rohm.com product structure silicon monolithic inte g rated circuit this p roduct is not desi g ned p rotection a g ainst radioactive ra y s switching regulators (integrated fet) 3.3v and 5v output low iq dc/dc converters bd99010efv-m bd99011efv-m general description the bd99010efv-m and bd99011efv-m are ultra low iq step-down dc/dc converters with integrated power mosfets for 3.3v and 5v, respectively. the sllmtm (simple light load mode) control ensures an ultra low quiescent current and high efficiency at low load situation as well as a high efficiency at high load situations while maintaining a regulated output voltage. the product is compliant with automotive standards and accommodates a maximum voltage of 42v. the minimum input voltage is 3.6 v in order to sustain output at cold cranking conditions. the current mode regulation loop gives a fast transient response and easy phase compensation. the bd99010efv-m and bd99011efv-m are available in a htssop-b24 package. in an application it requires a small number of external components and small pcb footprint. features ? low quiescent operating current: 22 a ? simple light load mode (sllm) ? supports cold cranking down to 3.6v ? output voltage accuracy: 2% ? synchronous rectifier ? soft start ? chip enable pin compatible with cmos logic and battery voltages ? forced pmw mode function ? current mode control with external compensation circuit ? over current protection, short circuit protection, over voltage protection for vout, under voltage lock out for vin and thermal protection circuits key specifications ? input voltage range: 3.6v to 35v (absolute maximum42v) (initial startup is over 3.9v) ? output voltage range: 3.3v (bd99010efv-m) 5v (bd99011efv-m) ? switch output current: 2a(max) ? switching frequency: 200khz to 500khz ? pch fet on resistance: 170m (typ) ? nch fet on resistance: 130m (typ) ? operating temperature range: -40c to +105c ? aec-q100 qualified package w(typ) x d(typ) x h(max) htssop-b24 7.80mm x 7.600mm x 1.00mm applications ? automotive battery powered supplies(cluster panel, car multimedia) ? industrial/consumer supplies. typical application circuit figure1. reference application circuit downloaded from: http:///
datasheet datasheet 2/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m pin configuration datasheet datasheet 3/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m block diagram vref i osc reg scp counter ibias uvlo tsd sllm logic s drv logic r slope soft start current sense ocp lvs _ i i y a a lvin i i i figure 3. block diagram description of blocks (1) internal regulator voltage (reg) this block generates the 4.5v supply of the internal circuitry. this function requires an external buffer capacitor connected to the reg pin. also the supply voltage has to be connected to the logic supply via the reg_l pin. a ceramic capacitor with of 1 f or more or with low esr with short leads to the reg, reg_l pin and ground is recommended. (2) enable by setting en below 0.8v, the device can be set in stand-by mode. when the stand-by mode is activated, almost all internal circuits are switched off to reduce t he current consumption from the power supply to 1 a (25c, typ.). because the en pin is not pulled-down internally, in order to set the device in standby the en pin has to be connected to gnd or supplied with the voltage below 0.8v. moreover, en sink current is below 0.1 a for voltages to approximately 14v. (3) fpwm by setting fpwm pin more than 2.0v, the device sw itches to forced pwm mode and operates as normal synchronous type dc/dc converter ie. no pulse skipping at low load conditions. with fpwm is disabled, the quiescent current is very low but t he step response is slow for large l oad step. with fpwm is enabled, the quiescent current is larger but the step response is fast fo r large load step. note that when the mode is changing from sllm to fpwm mode there will be an undershoot / over shoot. see figure 27 on page 13 and figure 31 on page 14. (4) soft start this block provides a function to pr event the overshoot of t he output voltage: vout and/or large inrush currents by controlling the error amplifier input voltage and increasing switching pulse width gradually at start up. the soft start time is set to 6ms (typ.). at low output load co nditions with fpwm is enabled, the soft start generates some noise on the output voltage during sweep up to about 2 volts. this phenomenon can be avoided by adding a small series resistance in the output buffer capacitor. downloaded from: http:/// datasheet datasheet 4/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m (5) error amplifier the error amplifier compares the output feedback voltage to the 1.2v internal reference voltage and outputs the difference as current to the comp pin, which voltage is used to determine the switching duty cycle. a t initial startup when the soft start works, the comp voltage is li mited to the soft start voltage. moreover, the external resistor and capacitor are required to comp pin as phase compensation circuit. (6) pwm modulator. the pwm modulator converts the voltage at the comp terminal to a continuous variable duty cycle that controls the output power transistors. at very low input voltages the duty cycle can become 1 indicating the high-side power transistor continuously in on-state. at very hi gh input voltages the duty cycle becomes very small but limited at an on-time of about 200ns. it should be noted that at high oscillation frequency settings this could lead to random pulse skipping. for instance at 500 khz the duty cycle is limited to values larger than 200ns / 2s = 10%. this means that for 3.3v output the input voltage is limited to 33 v when avoiding random pulse skips. in case, a higher input voltage is required the switching frequency has to be chosen lower. (7) oscillator the oscillation frequency is determined by the current goin g through the external resistor rt at constant voltage of ca. 0.3v. the frequency can be set in the range bet ween 200khz to 500khz. it should be noted that the frequency increases ca. 10% when the input voltage vin is lower than 4.5 v because in that condition the internal supply voltage vreg is also lowered. (8) vregb pin and low input voltage detection (lvin) vregb is the supply voltage of the hi gh-side driver and output power transistor. vregb voltage is referenced from pvin at voltage with 7.2v (typ.) . when vin voltage becomes below 6v (typ.), the lvin circuit is activated and vregb is shorted to gnd. by doi ng so the output power transistor is dr iven with the full supply voltage at cold cranking conditions. an external capacitor is required between pvin and vregb pin. a ceramic capacitor with 0.1 f or low esr type is recommended. (9) overcurrent protection (ocp) the overcurrent protection is activated when the sw curr ent exceeds 3.3a (typ.). once activated the on duty cycle will be limited and the output voltage lowered. (10) short circuit protection (scp) and scp counter the short circuit protection is activa ted after the output voltage (fb volt age) drops below 67% of the nominal voltage level and the overcurrent protec tion is activated (except during star tup). this indicated an output short and the short circuit protection will be activated. when the short circuit protection is activated, for a peri od of 1024 cycles of oscillation frequency, switching will be terminated by turning off the output transistors and t he ss and comp pins discharged. after this time out period the switching will resume including soft start. (11) under voltage lockout circuit (uvlo) if the vin drops below 3.4v (typ.) the uvlo is activated and the bd99010 and bd99011 is turned off. (12) thermal shutdown (tsd) if the chip temperature (tj) reaches or exceeds ca. 175c (typ.) the output is turned off. switching will resume with soft start when the temperature drops below ca. 150 c (typ.) (13) over voltage protection(ovp) the bd9901x is equipped with an integrated over voltag e protection (ovp) for output voltages exceeding 10% above nominal output voltage. the ovp terminates switching until the output voltage drops below nominal value again before resuming normal operation. the ovp is intend ed as a last-resort protection mechanism and should never trigger in well-designed applications. essentially there are two main root causes for an ovp event in a practical application: ? extremely fast and extreme input voltage variations, for instance a supply voltage step from a few volts to a maximum of 36v in a few micro seco nds. normally, an appropriate input filter should prevent this from occurring. ? extreme load current variations from maximum current to zero in very short time , for instance caused by a mechanical fuse or relay to trip. also it should be noted that when the output load is zero for a longer ti me while the ambient temperature is extremely high (above 105oc) a small leakage current th rough the high-side switch inside the bd9901x can cause the output voltage to be higher than the ovp leve l. in case this might happen in the application under extraordinary conditions, it is advised to bleed a small ou tput current exceeding this leakage. naturally, this current increases the ultra-low quiescent current of 22 a of a typical bd9901x application. downloaded from: http:/// datasheet datasheet 5/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m operation the bd99010efv-m and bd99011efv-m are a synchronous rectifying step-down switching regulator with fast transient response by the current mode pwm control system. th ese operate as pwm (pulse width modulation) mode for heavy load, and it operates as sllm (simple light load mode) operation for the light load to improve efficiency. when fpwm is enabled, the sllm is disabled and these device s operate only the current mode pwm control. (1) synchronous rectifier the application does not require an external schottky diode as commonly used in conventional dc/dc converter ics. the low-side power transistor provides two advantages: it reduces the switching losses by careful on-chip timing to prevent shoot-through and improves the leakage cu rrent (resulting in large quiescent cu rrent) at high operat ing temperatures. (2) current mode pwm control synthesizes an additional pwm control signal, representing the inductor current next to the conventional pwm control signal, representing the output voltage of the converter. the current feedback loop is essential to achieve regulation loop stability under all load conditions at so-called continuous condition buck conversion. (a) pwm (pulse width modulation) control the pwm circuit operates as follows: at the start of every swit ch cycle the oscillator sets t he flip-flop that controls the power transistors. this flip-flop is reset again when the sl ope signal (representing the inductor current) is exceeding the comp signal (representing the difference between output voltage and internal reference). (b) sllm (simple light load mode) control for small output currents, this device autom atically switches to sllm. in sllm, the device operates in pwm control by comparing the output voltage with an internal reference voltage. when the output voltages drops below the reference voltage the output makes several switching pulses in order to raise the output voltage above reference level again. next, switching pulses are skipped because the sw output is off. depending on the output l oad, the controller now waits at very low current consumption until the output voltage is lower than the reference voltage to resume switching. when the time in between the switching pulse skip becomes short the device exits the sllm mode and resumes normal continuous switching again. the load level of the switching pulse skip is changed by the input voltage and inductor value. figure 4. diagram of current mode pwm control figure 5. pwm switching timing chart figure 6. sllm switching timing chart downloaded from: http:/// datasheet datasheet 6/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m below the sw and vout waveforms during sllm and pwm are shown. figure 7. sw and vout waveforms at sllm figure 8. sw and vout waveforms at pwm (light load) (heavy load) recommended specification for sllm the figure below shows the relation between the input / output currents and output ripple voltage at sllm. sllm at light load is different from regular pwm and has an increased output ripple voltage. during sllm, the transient response for heavy loads is also slower. a reco mmendation is shown below on how to minimize the output ripple voltage and load changes at each of the control modes. figure 9. ripple voltage and load response at sllm downloaded from: http:/// datasheet datasheet 7/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m absolute maximum ratings parameter symbol rating unit supply voltage pv in ,v in -0.3 to 42 (1) v sw pin voltage v sw -1.0 to v in +0.6v v vregb pin v regb -0.3 to pv in -6.8v v pvin-vregb voltage pv in - v regb -0.3 to 15 v en pin v en -0.3 to v in +0.6v v rt, comp, reg, fpwm, reg_l vout pin voltage v rt , v comp , v reg , v reg _l, v fpwm , v vout -0.3 to 7 v power dissipation p d 4.00 (2) w storage temperature range t stg -55 to +150 c maximum junction temperature t jmax 150 c (1) do not however exceed pd. (2) pd derated at 32mw/c for temperature above ta=25c, mounted on a four layer pcb 70mm70mm1.6mm with same size copper area . recommended operating ratings parameter symbol rating unit supply voltage v in 3.6 (3) to 35 v output switch current i sw 0 to 2 (4) a oscillator frequency f osc 200k to 500k hz operating temperature range t opr -40 to +105 c (3) initial startup is over 3.9v. (4) do not however exceed pd. electrical characteristics (unless specified, ta=-40 to +105c, vin =13.2v) parameter symbol limit unit conditions min. typ. max. shut down current i stb - 1 10 ? a v en =low, ta=25c quiescent current1 i q 1 - 22 35 ? a iout=0a, ta=25c, v en =high, v fpwm = low (mode: sllm) quiescent current2 i q 2 - 22 50 ? a iout=0a, ta=-40 to 105c, v en =high, v fpwm = low (mode: sllm) circuit current i cc - 1.5 3.0 ma v en = high, v fpwm = high, rt=75k ? , v vout = 0v, reg voltage v reg 4.2 4.5 4.6 v vin = 5 to 42v vregb voltage v regb pv in -6.8 pv in -7.2 pv in -7.6 v vregb=-100 a under voltage lock out threshold v uvlo-th1 3.30 3.40 3.60 v vin sweep down under voltage lock out hysteresis v uvlo-hys 80 180 280 mv downloaded from: http:/// datasheet datasheet 8/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m electrical characteristics (unless specified, ta=-40 to +105c, vin =13.2v) output voltage bd99010 v out,3.3v 3.23 3.30 3.37 v vin = 6.5 to 18v, pwm mode 3.17 (5) 3.30 (5) 3.43 (5) v vin = 6.5 to 18v, sllm including output ripple (6) 3.1 3.30 - v vin = 3.6v, i load = 0 to 1a ta=25c bd99011 v out,5v 4.90 5.00 5.10 v vin = 6.5 to 18v, pwm mode 4.80 (5) 5.00 (5) 5.20 (5) v vin = 6.5 to 18v, sllm including output ripple (6) 4.5 4.73 - v vin = 5v, i load = 0 to 1a ta=25c high side fet on resistance r onh - 170 340 m ? i sw =-50ma, vin=13.2v ta=25c r onh_lv - 265 500 m ? i sw =-50ma, vin=3.6v ta=25c low side fet on resistance r onl - 130 260 m ? i sw =50ma, vin=13.2v ta=25c sw leakage current i oleak - - 10 ? a vin = 42v, v sw = 0v, v en =low, ta=25c dc output current limit i olimit 2.4 (5) 3.3 (5) 4.2 (5) a oscillator frequency f osc 320 400 480 khz rt=75k ? , v in = 6.5 to 18v soft start time t ss 3 6 11 ms enable en threshold v ih-en 2.0 - - v v il-en - - 0.8 v en hysteresis v en-hys 50 100 200 mv en sink current i en - 0.1 1.0 ? a v en =5v, ta=25c forced pwm mode fpwm threshold v ih-pwm 2.0 - - v pwm mode v il-pwm - - 0.8 v fpwm hysteresis v fpwm-hys 200 330 460 mv fpwm sink current i fpwm 4.0 7.5 12.0 ? a v fpwm =5v (5) not production tested. guaranteed by design. (6) using external components on page 17 and 18. downloaded from: http:/// datasheet datasheet 9/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m typical performance curves figure 10. efficiency log scale (bd99010efv-m : vout.3.3v) figure 11. efficiency linear scale (bd99010efv-m : vout.3.3v) figure 12. efficiency log scale (bd99011efv-m : vout.5v) figure 13. efficiency linear scale (bd99011efv-m: vout.5v) sllm pwm 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 1000 10000 efficiency [%] i load log scale [ma] vin=13.2v f=400khz pwm sllm 60 65 70 75 80 85 90 95 100 efficiency[%] i load linear scale [ma] vin=13.2v f=400khz sllm pwm 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 1000 10000 efficiency [%] i load log scale [ma] vin=13.2v f=400khz pwm sllm 60 65 70 75 80 85 90 95 100 efficiency[%] i load linear scale [ma] vin=13.2v f=400khz downloaded from: http:/// datasheet datasheet 10/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 i in [a] input voltage [v] 0 5 10 15 20 25 30 35 40 45 50 -40-20 0 20406080100 i in [ua] temperature[c] figure 14. i in vs. input voltage at no load figure 15. i in vs. temperature at no load figure 16. i in vs. i load figure 17. frequency vs. temperature bd99011efv-m bd99010efv-m vin=13.2v iout=0a ta=25c iout=0a 320 340 360 380 400 420 440 460 480 -40-20 0 20406080100 frequency [khz] temperature [c] 0 50 100 150 200 250 300 350 400 10 100 1000 i in [ua] i load log scale [ua] ta=25c vin=13.2v bd99011efv-m bd99010efv-m downloaded from: http:/// datasheet datasheet 11/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m 3.23 3.24 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 3.34 3.35 3.36 3.37 0 500 1000 1500 2000 output voltage [v] i load [m a] ta=25 ta=-40 ta=105 3.23 3.24 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 3.34 3.35 3.36 3.37 5 10152025303540 output voltage [v] input voltage [v] ta=25c ta=-40c ta=105c 3.23 3.24 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 3.34 3.35 3.36 3.37 5 10152025303540 output voltage [v] input voltage[v] ta=25c ta=-40c ta=105c figure 18. line regulation 1 (bd99010efv-m: vout.3.3v) figure 19. line regulation 2 (bd99010efv-m: vout.3.3v) figure 20. load regulation (bd99010efv-m: vout.3.3v) figure 21. output voltage vs. temperature (bd99010efv-m: vout.3.3v) f=400khz i load =1a v fpwm =low f=400khz i load =100a v fpwm =low vin=13.2v f=400khz v fpwm =low 3.23 3.24 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 3.34 3.35 3.36 3.37 -40-20 0 20406080100 output voltage [v] temperature[c] downloaded from: http:/// datasheet datasheet 12/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m 4.90 4.92 4.94 4.96 4.98 5.00 5.02 5.04 5.06 5.08 5.10 5 10152025303540 output voltage [v] input voltage[v] ta=25c ta=-40c ta=105c 4.90 4.92 4.94 4.96 4.98 5.00 5.02 5.04 5.06 5.08 5.10 5 10152025303540 output voltage [v] input voltage [v] ta=25c ta=-40c ta=105c 4.90 4.92 4.94 4.96 4.98 5.00 5.02 5.04 5.06 5.08 5.10 0 500 1000 1500 2000 output voltage [v] i load [m a] ta=25 ta=-40 ta=105 4.90 4.92 4.94 4.96 4.98 5.00 5.02 5.04 5.06 5.08 5.10 -40-20 0 20406080100 output voltage [v] temperature[c] figure 22. line regulation 1 (bd99011efv-m: vout.5v) figure 23. line regulation 2 (bd99011efv-m: vout.5v) figure 24. load regulation (bd99011efv-m: vout.5v) figure 25. output voltage vs. temperature (bd99011efv-m: vout.5v) f=400khz i load =1a v fpwm =low f=400khz i load =100a v fpwm =low vin=13.2v f=400khz v fpwm =low downloaded from: http:/// datasheet datasheet 13/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m figure 26. transient response (bd99010efv-m: vout.3.3v) figure 27. mode transition (sllm ? fwpm) (bd99010efv=m: vout.3.3v) figure 28. slow input ramp up and down (bd99010efv-m: vout.3.3v) figure 29. vin cranking (bd99010efv-m: vout.3.3v) sw 5v/div vin 5v/div vout 2v/div i load 2a/div vout (ac coupled) 100mv/div fpwm 5v/div sw 10v/div vin 5v/div sw 5v/div vout 2v/div vout (ac coupled) 100mv/div i load 1a/div vin=13.2v, f=400khz 200ma 2a downloaded from: http:/// datasheet datasheet 14/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m figure 30. transient response (bd99011efv-m: vout.5v) figure 31. mode transition (sllm ? fwpm) (bd99011efv-m: vout.5v) figure 32. slow input ramp up and down (bd99011efv-m: vout.5v) figure 33. vin cranking (bd99011efv-m: vout.5v) sw 5v/div vin 5v/div vout 5v/div i load 2a/div vout (ac coupled) 100mv/div fpwm 5v/div sw 10v/div vin 5v/div sw 5v/div vout 5v/div vin=3.6v vout (ac coupled) 100mv/div i load 1a/div vin=13.2v, f=400khz 200ma 2a downloaded from: http:/// datasheet datasheet 15/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m figure 34. en sink current figure 35. fpwm sink current figure 36. measurement figure 0 2 4 6 8 10 12 14 16 18 5 10152025303540 en sink current [ a] en voltage [v] ta=25c ta=-40c ta=105c 0 2 4 6 8 10 12 14 1.01.52.02.53.03.54.04.55.05.56.06.57.0 fpwm sink current [ a] fpwm voltage [v] ta=25c ta=-40c ta=105c i i i _ i i i load i in input voltage downloaded from: http:/// datasheet datasheet 16/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m timing chart (1) startup operations figure 37. timing chart 1 (start up operation) (2) protection operations (vin,pvin=13.2v, v en =high) figure 38. timing chart 2 (protection operation) vin, pvin internal soft start reg en uvlo release(typ : 3.58v) comp sw vout downloaded from: http:/// datasheet datasheet 17/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m applications figure 39. application circuit bd99010efv-m no component name component value description product name comment 1 cin (1) 220f capacitor, 50v, electrolytic - 2 c1 4.7f capacitor, 50v, ceramic gcm32er71h475ka55 3 c2 - capacitor, 50v, ceramic - 4 cout3 22f capacitor, 10v, ceramic gcm32er71a226ke12 5 cout4 22f capacitor, 10v, ceramic gcm32er71a226ke12 6 cout5 22f capacitor, 10v, ceramic gcm32er71a226ke12 7 c5 1f capacitor, 16v, ceramic gcm188r71c105ka64 8 c6 0.1f capacitor, 50v, ceramic gcm188r 7 1h104ka57 9 c7 2200pf capacitor, 50v, ceramic gcm188r71h222ka37 f=200khz 1500pf capacitor, 50v, ceramic gcm188r71h152ka37 f=300khz 1000pf capacitor, 50v, ceramic gcm188r71h102ka37 f=400khz 1000pf capacitor, 50v, ceramic gcm188r71h102ka37 f=500khz 10 c8 - capacitor, 16v, ceramic - 11 r1 27k ? resistor, mcr03ezp series f=200khz 27k ? resistor, mcr03ezp series f=300khz 33k ? resistor, mcr03ezp series f=400khz 33k ? resistor, mcr03ezp series f=500khz 12 rrt 164k ? resistor, mcr03ezp series f=200khz 104k ? resistor, mcr03ezp series f=300khz 75k ? resistor, mcr03ezp series f=400khz 58k ? resistor, mcr03ezp series f=500khz 13 r100 0 ? resistor, mcr03ezp series 14 l1 22h inductor clf10040t-220m-h f=200khz 15h inductor clf10040t-150m-h f=300khz 10h inductor clf10040t-100m-h f=400khz 10h inductor clf10040t-100m-h f=500khz (1): refer to setting the input capacitor in page 20/28. (1): refer to setting the input capacitor in page 20/28. downloaded from: http:/// datasheet datasheet 18/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m bd99011efv-m no component name component value description product name comment 1 cin (1) 220f capacitor, 50v, electrolytic - 2 c1 4.7f capacitor, 50v, ceramic gcm32er71h475ka55 3 c2 - capacitor, 50v, ceramic - 4 cout3 22f capacitor, 10v, ceramic gcm32er71a226ke12 5 cout4 22f capacitor, 10v, ceramic gcm32er71a226ke12 6 cout5 22f capacitor, 10v, ceramic gcm32er71a226ke12 7 c5 1f capacitor, 16v, ceramic gcm188r71c105ka64 8 c6 0.1f capacitor, 50v, ceramic gcm188r 7 1h104ka57 9 c7 2200pf capacitor, 50v, ceramic gcm188r71h222ka37 f=200khz 1500pf capacitor, 50v, ceramic gcm188r71h152ka37 f=300khz 1000pf capacitor, 50v, ceramic gcm188r71h102ka37 f=400khz 1000pf capacitor, 50v, ceramic gcm188r71h102ka37 f=500khz 10 c8 - capacitor, 16v, ceramic - 11 r1 20k ? resistor, mcr03ezp series f=200khz 20k ? resistor, mcr03ezp series f=300khz 20k ? resistor, mcr03ezp series f=400khz 20 ? resistor, mcr03ezp series f=500khz 12 rrt 164k ? resistor, mcr03ezp series f=200khz 104k ? resistor, mcr03ezp series f=300khz 75k ? resistor, mcr03ezp series f=400khz 58k ? resistor, mcr03ezp series f=500khz 13 r100 0 ? resistor, mcr03ezp series 14 l1 22h inductor clf10040t-220m-h f=200khz 15h inductor clf10040t-150m-h f=300khz 10h inductor clf10040t-100m-h f=400khz 10h inductor clf10040t-100m-h f=500khz (1): refer to setting the input capacitor in page 20/28. these are the reference value. these characteristics are influenced by the pcb layout pattern, used parts, etc. verification and confirmation with the actual application is recommended. downloaded from: http:/// datasheet datasheet 19/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m selection of external components (1) setting the inductor (l) value the inductor-value determines the output curr ent ripple. as shown in the following equation, the larger the i nductor, and the higher the switching frequency, the lower the ripple current. figure 40. the optimal output current ripple setti ng is ca. 30% of the maximum current. ( il: output current ripple, f: switching frequency f igure 41. care should be taken not to exceed the maximum current rating of the inductor since this will lead to magnetic saturation and consequently to loss of efficiency. it is recommended to allo w for sufficient margin to ensure that the peak current does not exceed the coil current rating. use low resistance (dcr , acr) coils to minimize coil loss and increase efficiency. (2) setting the output capacitor cout value select the output capacitor with consideration to the accept able ripple voltage (vp-p) at high output current conditions. the following equation is used to determine the output ripple voltage. in which: f denotes the switching frequency the output cout setting needs to be kept with in the allowable ripple voltage range. the above formula gives an indication of the ripple voltage and sufficient margin should be taken to accommodate for aging and component variations. low esr capacitors enable a lower output ripple voltage. also, the value of the buffer capacitor should not be taken too large in order to meet the r equirement for output startup time within the soft start time range. as an estimate for the maximum value of cout the following estimation can be taken: t ss : soft start time i limit : output current limit value note: non-optimal capacitance values may cause startup problems. especially in cases of extremely large capacitance values, the possibility exists that the inrush curr ent at startup will activate the overcurrent protection, thus slowing down the outpu t voltage startup. at even more extreme values, one faces the risk of falsely triggering the scp (short circuit protection) causi ng the output voltage not to start up at all. therefore, validation and conformation with the actual application is recommended. also at low load conditions the output buffer capacitor is de termining the output voltage rippl e but via a different mechanism. the bd9901xefv-m makes a small series of switching cycles which charges the buffer capacitor following a staircase shape curve. consecutively, the switching is paused until the buffer capacito r is discharged according to a linear shape curve again to the reference level. generally, this leads to a somewhat larger voltage ripple as in higher load conditions. downloaded from: http:/// datasheet datasheet 20/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m (3) setting input capacitor the input capacitor acts as (i) deco upling capacitor (ii) bulk capacitor. decoupling capacitor: cerami c capacitor of value 4.7 f to 10 f is necessary. the voltage rating should be > 1.2x max input voltage or > 2 x normal input voltage. it is better to place it as close as possible to pvin pin and pgnd pin. bulk capacitor: it acts as a backup power supply and tries to keep the input potential when the input power supply drop s. the low esr electrolytic capacitor with large capacity is suitable for the bulk capacitor. based on application appropriate value can be taken. when the impedance on the input side is high (long wiring from the power supply to vin, etc.), the high capacity is needed in application, it is necessary to verify that there is no problem at output due to the decrease of vin at tr ansient response. please be careful not to exceed the rated ripple current of the capacitor. the i rms value of the input ripple current ca n be calculated with the expression below. figure 42. in addition, in the automotive and other appl ications requiring high reliability, it is recommended that the multiple electrolyt ic capacitors are connected in parallel to avoid a dry up. in order to reduce a risk of destruction because of short in a ceramic capacitor, we recommend using 2 serials +2 parallel structure. since the lineup also of what packed 2 series and 2 parallel structure in 1package, respectively is carried out by each capacitor supplier, please confirm to each supplier. (4) setting the switching frequency the switching frequency is set with the resistor rt. the setting range is 200khz to 500khz.the relation between the resistance value and the oscillation frequency is shown in the table below. selecting a resistor outside the range show n below may cause malfunctions of the switching regulator. rt resistance oscillation frequency 164 k ? 128 k ? 104 k ? 88 k ? 75 k ? 66 k ? 58 k ? 200khz 250khz 300khz 350khz 400khz 450khz 500khz downloaded from: http:/// datasheet datasheet 21/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m (5) setting the phase compensation circuit the phase compensation circuitry provides regulation loop stab ility and ensures sufficient regulation bandwidth for rapid load and supply voltage step responses. there are two condition s to avoid (near) negative feedback that causes regulation in stability: (a) at the frequency of unity loop gai n(0db), fc. the phase delay should be 150 or less. (i.e. the so-called phase margin is 30 or higher) (b) as the dc/dc converter application is sampled accordin g to the switching frequency, fc should be set to 1/10 or less of the switching frequency. in order to achieve sufficient rapid step response fc should be as high as possible and consequently the switching frequency has to be set as high as possible. the phase compensation is set by the capacitors and resistors se rially connected to the comp pin. achieving stability by using the phase compensation is done by cancelling the 2 poles (error amp pole denoted as fp1 and power stage pole denoted as fp2) of the regulation loop by means of a zero, denoted as fz1, of the capacitor c3 in the phase compensation circuit. fp1, fp2 and fz1 are determined by the formulas below. in the formula above, g is the error amp trans conductance (140 a/v) and a v is the error amp voltage gain (2500 v/v) figure 43. during startup in forced pwm mode at light loads the duty cycl e of the regulator has to be very small and the regulation loop has a tendency to become marginally instable causing a larg e voltage ripple or noise. this noise during startup can be prevented by creating another zero, fz2, in the regulation loop with resistor r out . please note that adding this resistor is effectively increasing the esr of the output buffer capacitor and hence increasing the ripple voltage according eq. 2. in practice a small value su ffices to remove all noise during soft start while keeping a small ripple voltage of ca. 50mv p-p at high load situations. in case, the noise at low voltages during startup is not negatively affecting other system components the resistor r out can be omitted. moreover, in case of the start-up at sllm with light load, the ripple voltage does not become large during the soft start. this setting is obtained by using a simplifie d calculation, therefore, small adjustments in values in the actual application may be required. also as these characteristics are influenced by the substrate layout, load conditions, etc. validation and confirmation with the actual application at time of mass production design is recommended. fz1= 2 c 3 r 1 1 fp1= 2 c 3 a v g m downloaded from: http:/// datasheet datasheet 22/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m pcb layout pattern the pcb layout greatly influences the stable operation of the ic. depending on the pcb layout ic might not show its original characteristics or might not function properly. please note the following points when creation the pcb layou t. moreover, fig 35 shows the recommended layout pattern and component placement. ? the input capacitors c1, c2 and cin should be placed as close as possible to the vin, pvin gnd and pgnd. especially, c1 and c2 should be placed as close as possible to pvin and pgnd pin. ? the output voltage feedback line vout should be separated fr om lines with a lot of noise such as the sw line. ? the output capacitors cout3, cout4 and cout5 should be placed in cl ose proximity to inductor l1. ? the inductor l1 should be placed as close as close as po ssible to the sw pin. the pattern area of the sw node should be as small as possible. ? en pin has to be connected gnd or supplied with the vo ltage below 0.8v to set the device in shut down mode because the en pin is not pulled-down internally. ? the exposed die pad on the bottom of the package has to be soldered to gnd. then the device is connected to gnd electrically and gets good thermal performance. ? the feedback frequency characteristics (phase margin) can be measured by inserting a resistor at the location of r100 and using fra. however, this should be shorted during normal operation. datasheet datasheet 23/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 power dissipation: pd [w] ambient temperature: ta [ ] (1) ? 4.0w (2) ? 2.8w (3) ? 1.1w heat dissipation the allowance maximum junction temperature tj of bd99010efv-m and bd99011efv-m is 150 . when the junction temperature becomes 150 or more, the thermal shutdown circuit operates, and the device becomes shut down. therefore, it is necessary to design t he system requirements and the board layout so that the junction temperature should not exceed 150 in the power-supply voltage, the output l oad, and the operating temperature rating. the maximum junction temperature can be determined from ambient temperature ta, thermal resistance ja of package and heat dissipation p of ic by the following equation. tj = ta + ja p [ ] thermal resistance ja of the package changes depending on the number of layers and the area of the copper foil of the board etc. heat dissipation ptotal of ic can be calculated by the next expression. ptotal = picc + pron + psw [w] picc = vin icc ??? heat dissipation in control circuit pron = ron iout2 ??? heat dissipation in output fet ron = d ronh + (1 - d) ronl psw = tr iout vin fosc ??? heat dissipation in switching icc : circuit current (refer to page. 6) ronh : on resistance of h-side fet (refer to page. 7) ronl : on resistance of l-side fet (refer to page. 7) fosc : oscillator frequency d : on duty (=vout/ vin) iout : output load current tr : switching rise and fall time (approximately 20ns) power dissipation vs. temperature characteristics (1) standalone ic (2) mounted on a rohm 2 layer standard board 70mm70mm1.6mm glass-epoxy board (3) mounted on a rohm 4 layer standard board 70mm70mm1.6mm glass-epoxy board figure 45. power dissipation vs. temperature characteristics downloaded from: http:/// datasheet datasheet 24/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m i/o equivalence circuits figure 46. equivalent circuit figure sw, vregb reg, reg_l vout rt comp en fpwm is for bd99011efv-m downloaded from: http:/// datasheet datasheet 25/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m operational notes 1. absolute maximum ratings exceeding the absolute maximum rating for supply voltage, oper ating temperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc). therefore, if any sp ecial mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2. gnd electric potential keep the gnd terminal potential at the lowest (minimum) potential under any operati ng condition. furthermore, excluding the sw pin, the voltage of all pin should never drop below that of gnd. in case there is a pin with a voltage lower than gnd implement countermeasures such as using a bypass route. 3. power dissipation should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. therefore allow for suffici ent margins to ensure use within the power dissipation rating. 4. input power supply concerning the input pins vin and pvin, the layout pattern should be as short as possible and free from electrical interferences. in case the impedance of the input supply line is large, the re sulting voltage drop at high load situation and low supply voltage will cause repeated uvlo cycles so metimes referred to as chattering. therefore, the impedance of the input line should be so sm all that the worst case voltage drop is smaller than the uvlo hysteresis. to prevent damage to or destruction of the chip, the input filter wh ich can be contain 0.5v/ s against the voltage of vin and pnin should be considered. 5. electrical characteristics the electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified. 6. thermal shutdown (tsd) this ic incorporates and integrated thermal shutdown ci rcuit to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (tj) will rise and the tsd circuit will be activate d and turn all output pins off. after the tj falls below the tsd threshold the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 7. inter-pin shorting and mounting errors ensure that when mounting the ic on t he pcb the direction and position are corre ct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering between the output, input and gnd pin may result in damaging the ic. 8. in some applications, the vin and pin potential might be re versed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external ca pacitor is charged, the vin shorts to the gnd. for the reg and reg_l output pin use a capacitor with a capacitance with less than 100 f. we also recommend using reverse polarity diodes in series or a bypass diode between all pins and the v bat pin. figure 47. 9. operation in strong electromagnetic fields use caution when operating in the presence of strong electromagnetic fields, as this may cause the ic to malfunction. 10. in applications where the output pin is connected to a large inductive load, a counter-emf (electromotive force) might occur at startup or shutdown. a diode should be added for protection. downloaded from: http:/// datasheet datasheet 26/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m 11. testing on application boards the ic needs to be discharged after each test process as, wh ile using the application board for testing, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with transportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 12. gnd wiring pattern when both a small-signal gnd and a high current gnd are present, single-point grounding (at the set standard point) is recommended. this in order to separate the small- signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high curr ent do not cause any voltage change in the small-signal gnd. similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component gnd. 13. this monolithic ic contains p+ isol ation and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. relations between each potential may form as shown in the example below, where a resistor and transistor are connected to a pin: o with the resistor, when gnd pin a, and with the transistor (npn), when gnd pin b: the p-n junction operates as a parasitic diode. o with the transistor (npn), when gnd pin b: the p-n junction operates as a parasitic transistor by in teracting with the n layers of elements in proximity to the parasitic diode described above. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd. figure 48. 14. reg pin reg is output that supplies the internal circuit. we do not recommend using reg for any other purpose. downloaded from: http:/// datasheet datasheet 27/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m ordering information b d 9 9 0 1 x e f v me 2 part number 99010 : 3.3v output 99011 : 5v output package efv: htssop-b24 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram part number marking output voltage (v) bd99010 3.3 bd99011 5.0 (unit : mm) htssop-b24 0.65 1.0max 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04 0.08 m s 0.08 1.0 0.2 0.53 0.15 0.17 +0.05 - 0.03 4 + 6 4 s 24 13 11 2 0.325 (3.4) (5.0) 7.8 0.1 7.6 0.2 5.6 0.1 (max 8.15 include burr) 1pin mark ? order quantity needs to be multiple of the minimum quantity. datasheet datasheet 28/28 tsz02201-0w1w0al00030-1-2 ? 2013 rohm co., ltd. all rights reserved. 07.jul.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd99010efv-m, bd99011efv-m revision history date revision changes 28.feb.2013 rev.001 new release as draft. 23.jun.2014 rev.002 p.1 key specifications , input voltage range change. (record both absolute maximum ratings and recommended operating ratings) figure.1 correct. p.4 uvlo , correct comment. (reg voltage vin voltage). p.7 absolute maximum ratings, add parameter [pvin-vreb voltage]. delete comment (2) p.17,18 change inductors product name. 7.july.2014 rev.003 p.1 key specifications sentense change aec-q100 qualification is in progress aec-q100 qualified downloaded from: http:/// datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
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